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Published on: 30. July 2024

TSMC: Construction of the first European chip plant begins in August

2023 World Semiconductor Congress in Nanjing Visitors visit the booth of TSMC at the 2023 World Semiconductor Congress in Nanjing, Jiangsu province, China, July 19, 2023. Nanjing China PUBLICATIONxNOTxINxFRA Copyright: xCFOTOx originalFilename: cfoto-2023worl230719_np2Tl.jpg

TSMC CEO C.C. Wei will break ground for the construction of the chip company's Dresden plant on August 20. Construction is expected to start by the end of 2024. The plant, named European Semiconductor Manufacturing ESMC, is expected to go into operation in late 2027.

CB
Carolyn Braun

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Last updated: 24. July 2025

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